According to the recent study the Flexible Printed Circuit Board (FPC) Market is projected to reach an estimated $22.0 billion by 2030from $18.2 billion in 2023, at a CAGR of 3.0% from 2024 to 2030. Growth in this market is primarily driven by increasing demand for FPC in the telecommunication industry, growth in connected devices, and advancement in automotive electronics.Browse 122 figures / charts and 134 tables in this 197 -page report to understand trends, opportunities and forecast in flexible printed circuit board (FPC) market by end use industry (computers/peripherals, telecommunication, consumer electronics, medical, automotive, aerospace and defense, and others), technology (single layer, double layer, multi-layer and rigid flex), laminate material type (polyimide and polyester & others), laminate raw material usage (polyimide films and polyester & other films), and region (North America, Europe, Asia Pacific, and the Rest of the World).
Lucintel forecasts that multi-layer will remain the largest technology type due to increasing demand in the automotive and telecommunication industries. The rigid-flex substrate segment is expected to witness the highest growth during the forecast period due to growing demand for smartphone and display applications.
Telecommunication will remain the largest end use industry, supported by increasing demand for smartphones, data storage, 5G technology, and network solution sectors. The medical end use market is expected to witness the highest growth during the forecast period because it will witness increasing demand for portable, wireless, and more complex electronic assemblies.
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Asia Pacific is expected to remain the largest market and witness the highest growth over the forecast period due to increasing ADAS and vehicle safety features in automotive and growth in consumer electronic devices and telecommunication products. Increasing usage of electric vehicles due to growing environmental concerns and regulations is also expected to drive the demand for FPC in this region.
Zhen Ding Technology Holding Limited (ZDT), NOK Corporation, Sumitomo Electric, Flexium Interconnect Inc., Fujikura Ltd., Nitto Denko Corporation, Interflex, Samsung Electro-Mechanics, Daeduck GDS, CompeqSamtecIncare the major suppliers in the flexible printed circuit board (FPC) market.
This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or write us at [email protected]
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Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: [email protected]
Tel. +1 972 636 5056
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